The unique event dedicated to materials characterisation in Grenoble
On this occasion, the Characterisation Platforms based in Grenoble will open the doors of their facilities to industry. People from industry united by their passion for innovation, with a business or a scientific background, will be joining us to learn more about advanced material characterisation with electrons, synchrotron X-rays and neutron for micro- nano-electronics, engineering and energy.
Bring your questions and ask about your challenge to our scientists at the confidential B2B meeting! Register now
Do you know thermal neutron tests are required to assess the reliability of highly integrated devices for critical applications? Come to Radecs2018 at the booth 8, we can show you the advantages of our Sngle Entry Point PAC-G. People from Airbus team have already found their solution, find out the industrial case study: https://goo.gl/q1izsA
We can allow you to have access, on the same site, to a broad spectrum of neutron energies from fast to thermal neutrons (14 MeV, 2.5 MeV and 25 meV) at ILL – Institut Laue Langevin and LPSC – Laboratory of Subatomic Physics and Cosmology.
At the heart of the European Silicon Valley, a fruitful day of business exchanges, conferences and networking, to build future partnerships.
The Platform for Advanced Characterisation – Grenoble (PAC-G) will be present to meet their clients in B2B meetings to show the competitive advantages offered to the nano and micro-electronics industry by the characterisation services provided by ILL – Institut Laue Langevin, ESRF – The European Synchrotron, LPSC CNRS and CEA-Leti.
Schedule a meeting writing to firstname.lastname@example.org
Our next meeting is the MiNaPAD Forum, 2 days of conference where we will speak about micro and nano imaging by synchrotron X-rays and neutron reflectivity to characterise interfaces defects in wafers. The objective of the Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and electronics packaging community.